SMT Reflow Soldering Test Board

SMT Reflow Soldering Test Board is a low cost option used with a reflow oven or hot air soldering to test the quality of the reflow. Stencil not included MOE-03-01.

SMT Reflow Soldering Test Boards are used in a reflow oven with a single board or a grid of boards placed on the reflow oven to test temperature offset and temperature reflow profile. Low cost and DIY reflow ovens come with a set of challenges. One challenge is that the temperature displayed may not be accurate (it can be off by as much as 20C), which leads to non-consistent flow due to low temperature, or charred PCBs from excess temperature. You can also have non-consistent temperatures from one side to the other side of the reflow oven as well as from the front to the back, and the difference in temperature can vary as much as 30C. By utilizing the SMT Reflow Soldering Test Board to visualize the reflow process in your oven, you will have a better quality reflow process.

When used with with hot air soldering you can practice your hot air reflow process without risking components on the PCB. You can also learn the characteristics of your soldering process for each individual solder paste. Some of the problems that can arise include heat damage to components, pads without flowed solder, too much heat, not enough heat, too much heat between the flux becoming liquid and the soldering flowing, etc. By using the SMT Reflow Soldering Test Board you can learn how to flow better throughout the circuit design process.

Large orders may come with four boards in one with a breakable v-cut between. This will allow for easer use with a Stencil. The pads do not come with solder paste preinstalled, Stencil sold separately MOE-03-01.